Version 3.0 of Flomerics'(www.flomerics.com) Flo/PCB thermal simulation software helps solve thermal problems in solder reflow processing associated with the use of lead-free solders. In particular, ...

Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

Electronics companies at the leading edge of performance are being forced to address board-level thermal requirements at the earliest stages of design. Printed circuit boards (PCBs) constitute the ...

Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...

Printed Circuit Boards (PCBs) are a fundamental part of the majority of electronics systems. They are primarily designed to mechanically support and electrically connect electronic components, and are ...

While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component ...

S parameters play a dominant role in high speed PCB simulation and verification. Generation of S parameters is relatively easy at high frequency in comparison to other parameters like Y and Z. In this ...

Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Today’s integrated circuit (IC ...

Maybe my Google-fu sucks, but I've been having trouble locating good circuit design software that doesn't cost an arm and a leg. At the moment, I'm mostly just interested in something that will help ...

This paper analyzes the efficiency of silicon MOSFETs in surface-mount (SMD) packages with top-side cooling compared to bottom-side cooling packages in terms of thermal performance, lowering both ...